Pad arrangement of driver ic chip for lcd and related circuit pattern structure of tab package

ABSTRACT

Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application is a Divisional of U.S. Ser. No. 11/269,362, filed onNov. 7, 2005, now pending, which claims priority from Korean PatentApplication No. 2004-90666, which was filed in the Korean IntellectualProperty Office on Nov. 9, 2004, all of which are hereby incorporated byreference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to integrated circuit (IC) chipand package technology and, more particularly, to chip pad arrangementsfor a driver IC chip in a liquid crystal display (LCD) and a relatedcircuit pattern structure of a tape automated bonding (TAB) package.

2. Description of the Related Art

Since the 1960′s, LCDs have been used in calculators and digitalwatches. In recent years, LCDs represent remarkable progress in monitorsfor notebook computers and desktop computers. LCD technology will belikely applied to many products in a variety of fields.

In general, an LCD module is composed of an LCD panel having a liquidcrystal suspension between two transparent panels, a backlightilluminating the LCD panel from beneath, and a driver unit applied tothe LCD panel.

FIG. 1 shows, in a plan view, a conventional LCD module. FIG. 2 is across-sectional view taken along the line II-II in FIG. 1.

Referring to FIGS. 1 and 2, an LCD panel 10 has two glass substrates 11and 12 and a liquid crystal layer 13 interposed between the glasssubstrates 11 and 12. On the glass substrates 11 and 12 are respectivelyprovided thin film transistors (TFTs) and color filters. Subjecting theliquid crystal layer 13 to varying amounts of electrical charges, underthe control the TFTs, crystals in the liquid crystal layer 13 changeorientation to allow variation in the amount of light passingtherethrough.

A driver unit 20, in the form of a TAB package, includes a base film 21with circuit patterns 22 thereon. An IC chip 30 attaches to the circuitpatterns 22 of the base film 21. The IC chip 30 is mechanically andelectrically connected to the circuit patterns 22 through conductivebumps such as metal bumps 31 formed on input/output (I/O) pads of the ICchip 30. Most of the circuit patterns 22 are covered with a solderresist 23. Furthermore, a sealing resin 24, interposed between the ICchip 30 and the base film 21, protects the electrical connections. Thistype of TAB package 20 is known in the art as a chip-on-film (COF)package.

The TAB package 20 is connected to the TFTs of substrate 11 of the LCDpanel 10 at a first peripheral region 25. In a typical LCD module, theTAB package 20 is further connected to a printed circuit board (PCB) ata second peripheral region 26. The PCB offers control signals and datasignals necessary to driving the LCD panel 10. However, a recentadvanced LCD module does not include the PCB, instead it transfers thefunctions of the PCB to both the IC chip 30 and the LCD panel 10. Theabove-discussed LCD module in FIGS. 1 and 2 is of the latter case, i.e.,a TAB package without the PCB connections in the second peripheralregion 26.

FIG. 3 shows, in a plan view, a pad arrangement of the IC chip 30 andthe circuit patterns 22 of the TAB package 20 shown in FIGS. 1 and 2.

Referring to FIG. 3, because of the absence of the PCB connections inperipheral region 26, both the output patterns 22 a and the inputpatterns 22 b are routed to the first peripheral region 25. However,since the input patterns 22 b must pass though the second peripheralregion 26, the relatively narrower second peripheral region 26accommodates only a limited number of the patterns 22.

The IC chip 30, used as the LCD driver, has in general a much greaternumber of output pads 32 a than input pads 32 b.

If the second peripheral region 26 of the TAB package 20 increases inwidth, the output pads 32 a may also be arranged along the upper longerside of the IC chip 30. However, the increase in width of the secondperipheral region 26 may not only cause an unfavorable rise inproduction cost, but also lead to an increased size of the final LCDproduct. Accordingly, a new technique that arranges the output pads 32 bto the upper longer side of the IC chip 30 without increasing the sizeof the TAB package 20 is desirable.

SUMMARY

Exemplary, non-limiting embodiments of the present invention provide apad arrangement of an integrated circuit (IC) chip. Exemplary,non-limiting embodiments of the present invention further provide acircuit pattern structure of an IC package.

The IC chip according to one exemplary embodiment of the presentinvention comprises a first longer side, a second longer side, a pair ofshorter sides, and a number of input/output (I/O) pads arranged thereon.The I/O pads include first output pads arranged along the first longerside, and second output pads arranged along the second longer side.

In the IC chip, the first output pads and the second output pads may belocated at offset longitudinal positions along the respective longersides. Furthermore, the number of the second output pads may be smallerthan the number of the first output pads. The I/O pads may furtherinclude third output pads arranged along at least one of the shortersides, and may further include input pads arranged along the secondlonger side.

The package according to another exemplary embodiment of the presentinvention comprises an IC chip and a base film. The IC chip includes afirst longer side, a second longer side, a pair of shorter sides, and aplurality of I/O pads arranged thereon. The I/O pads have first outputpads arranged along the first longer side, and second output padsarranged along the second longer side. The base film includes a topsurface, a bottom surface opposing to the top surface, first outputpatterns formed on one of the top and bottom surfaces, and second outputpatterns formed on the other of the top and bottom surfaces. The firstoutput patterns are electrically connected to the first output pads, andthe second output patterns are electrically connected to the secondoutput pads. Both the first and second output patterns pass over thefirst longer side.

In this package, the first output patterns may be formed on the bottomsurface of the base film, and the second output patterns may be formedon the top surface of the base film. The IC chip may further includemetal bumps formed on the respective first output pads. In this case,the first output patterns may be joined to the metal bumps on the firstoutput pads, respectively.

Furthermore, the IC chip may further include metal bumps formed on therespective second output pads. In this case, each of the second outputpatterns may have a major part formed on the top surface of the basefilm, a minor part formed on the bottom surface of the base film, and aconnection via formed within the base film and connecting the major partand the minor part. The minor parts of the second output patterns may bejoined to the metal bumps on the second output pads, respectively.

Additionally, the first output pads and the second output pads may belocated at different positions along the respective longer sides. Thefirst output patterns and the second output patterns may pass throughthe first longer side by turns. The number of the second output pads maybe smaller than the number of the first output pads.

Moreover, the I/O pads may further include third output pads arrangedalong at least one of the shorter sides. In this case, the base film mayfurther include third output patterns electrically connected to thethird output pads and crossing over at least one of the shorter sides.And, the I/O pads may further include input pads arranged along thesecond longer side. In this case, the base film may further includeinput patterns electrically connected to the input pads and crossingover the second longer side.

The package according to still another exemplary embodiment of thepresent invention comprises an IC chip and a base film. The IC chipincludes a first longer side, a second longer side, a pair of shortersides, and a number of I/O pads arranged thereon. The I/O pads havefirst output pads arranged along the first longer side, and secondoutput pads arranged along the second longer side. The base filmincludes a top surface, a bottom surface opposing to the top surface,first output patterns formed on the bottom surface, and second outputpatterns formed on the bottom surface. The first output patterns areelectrically connected to the first output pads, crossing over the firstlonger side. The second output patterns are electrically connected tothe second output pads, crossing over at least one of the shorter sides.

In this package, the IC chip may further include metal bumps formed onthe respective first and second output pads. The first and second outputpatterns may be joined to the metal bumps on the respective output pads.The number of the second output pads may be smaller than the number ofthe first output pads.

The I/O pads may further include input pads arranged along the secondlonger side. In this case, the base film may further include inputpatterns electrically connected to the input pads and crossing over thesecond longer side. The pitch of the second output patterns may besmaller than the pitch of the second output pads.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 (Prior Art) is a plan view showing a conventional LCD module.

FIG. 2 (Prior Art) is a cross-sectional view taken along the line II-IIin FIG. 1.

FIG. 3 (Prior Art) is a plan view showing a pad arrangement of an ICchip and circuit patterns of a TAB package shown in FIGS. 1 and 2.

FIG. 4 is a partial plan view showing a pad arrangement of an IC chipand inner circuit patterns of a TAB package in accordance with oneexemplary embodiment of the present invention.

FIG. 5 is a cross-sectional view taken along the line V-V in FIG. 4.

FIG. 6 is a partial plan view showing outer circuit patterns of the TABpackage shown in FIGS. 4 and 5.

FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG. 6.

FIG. 8 is a plan view showing a pad arrangement of an IC chip andcircuit patterns of a TAB package in accordance with another exemplaryembodiment of the present invention.

FIG. 9 is a plan view illustrating a further embodiment similar to thatof FIGS. 4 and 5, but without longitudinally offsetting pad locations.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION

Exemplary, non-limiting embodiments of the present invention will now bedescribed more fully hereinafter with reference to the accompanyingdrawings. This invention may, however, be embodied in many differentforms and should not be construed as limited to the exemplaryembodiments set forth herein. Rather, the disclosed embodiments areprovided to make this disclosure thorough and complete, and to conveyaspects of the invention to those skilled in the art. The principles andfeatures of this invention may be employed in varied and numerousembodiments beyond that shown herein without departing from the scope ofthe invention.

In is noted that some well-known structures and processes are notdescribed or illustrated in detail to avoid obscuring the essence of thepresent invention. It is also noted that the figures are not drawn toscale. Rather, for simplicity and clarity of illustration, thedimensions of some of the elements are exaggerated relative to otherelements. Like reference numerals are used for like and correspondingparts of the various drawings.

FIG. 4 shows, in a partial plan view, a pad arrangement of an IC chip 50and inner circuit patterns of a TAB package 40 in accordance with oneexemplary embodiment of the present invention. FIG. 5 is across-sectional view taken along the line V-V in FIG. 4.

Referring to FIGS. 4 and 5, the IC chip 50 has a first longer side 50 a,a second longer side 50 b, and a pair of shorter sides 50 c (only one ofthe sides 50 c being shown in FIG. 4). The IC chip 50 may be an LCDdriver chip such as, for example, a gate driver chip.

The IC chip 50 further has a great number of input/output (I/O) padsarranged thereon, including arrangements along the sides 50 a, 50 b and50 c. As discussed above, the IC chip 50 has, in general, a much greaternumber of output pads than input pads. For example, the number of theinput pads can be about twenty, whereas the number of the output padscan reach about two hundred sixty. As will be appreciated, for purposesof illustration herein only a subset of the I/O pads are shown with itbeing understood that the illustrated methods of connection can beapplied to other pads not necessarily shown herein.

In this embodiment, the output pads 52 a, 52 b and 52 c of the IC chip50 are arranged along four sides 50 a, 50 b and 50 c. Hereinafter, theoutput pads 52 a arranged along the first longer side 50 a will bereferenced as first output pads. Similarly, the output pads 52 b and 52c are arranged along the second longer side 50 b and along the shortersides 50 c, respectively, and will be referenced as second output padsand third output pads, respectively.

The first output pads 52 a are arranged, for example, along the whole ofthe first longer side 50 a. However, the second output pads 52 b arearranged along portions of the second longer side 50 b. The third outputpads 52 c are arranged along the whole or along portions of the shortersides 50 c. On the other hand, the input pads (not shown) are arrangedalong portions of the second longer side 50 b, for example, along acentral portion of side 50 b. Since the second output pads 52 b as wellas the input pads are disposed along the second longer side 50 b, thenumber of the second output pads 52 b is smaller than the number of thefirst output pads 52a when disposed fully along the first longer side 50a.

Conductive bumps such as metal bumps 51 are formed on the output pads 52a, 52 b and 52 c and on the input pads. All the I/O pads may be made ofaluminum (Al) or copper (Cu). The metal bumps 51 may be made of suitablemetal such as gold (Au), copper (Cu) and solder. The metal bumps 51mechanically and electrically connect the IC chip 50 to circuit patterns42, 43 and 44 of a base film 41. The base film 41 has a plurality of thecircuit patterns 42, 43 and 44. The base film 41 may be made of flexiblenon-conductive material such as polyimide, and the circuit patterns 42,43 and 44 may be made of copper (Cu). The circuit patterns have firstoutput patterns 42 connected to the first output pads 52 a, secondoutput patterns 43 connected to the second output pads 52 b, thirdoutput patterns 44 connected to the third output pads 52 c, and inputpatterns (not shown) connected to the input pads.

As illustrated in FIG. 4, the first output patterns 42 and the secondoutput patterns 43 are drawn out in the same direction from thecorresponding output pads 52 a and 52 b, e.g., both crossing or passingover the first longer side 50 a of the IC chip 50. On the other hand,the third output patterns 44 are drawn out in another direction from thecorresponding pads 52 c, e.g., crossing or passing over the adjacentshorter side 50 c. Although not shown, the input patterns as well can bedrawn out in the same direction as the first and second output patterns42 and 43. The first output pads 52 a and the second output pads 52 bare located at different or interleaved relative positions along eachlonger side 50 a and 50 b. In other words, pads 52 a lie along side 50 aat given spacing and longitudinal position while pads 52 b lie alongside 50 b at the same given spacing, but offset in longitudinalposition. Therefore, with the first and second output patterns 42 and 43extending in the same direction toward side 50 a, patterns 42 and 43pass in interleaved relation across the side 50 a.

The base film 41 has a bottom surface facing the IC chip 50 and a topsurface opposite the bottom surface. As illustrated in FIG. 5, the firstoutput patterns 42 are formed on the bottom surface of the base film 41.The third output patterns and the input patterns as well are formed onthe bottom surface. Each second output pattern 43 has a major part 43 a,a minor part 43 b, and a connection via 43 c. The major parts 43 a ofthe second output patterns 43 are formed on the top surface of the basefilm 41, but the minor parts 43 b are formed on the bottom surface. Theconnection via 43 c for each pattern 43 is selectively formed within orthrough the base film 41 and connects the major part 43 a and the minorpart 43 b. Therefore, the first output patterns 42, the third outputpatterns 44 and the input patterns are directly joined to thecorresponding metal bumps 51. The second output patterns 43, however,are indirectly joined to the corresponding metal bumps 51 by means ofthe corresponding minor part 43 b and the corresponding connection via43 c.

Both surfaces of the base film 41 are mostly covered with a solderresist 45 for protecting the circuit patterns. Specifically, the topsurface is wholly covered with the solder resist 45, whereas the bottomsurface is partly covered with the solder resist 45, e.g., except at thechip-attachment portions. A sealing resin 46, for example epoxy, isformed in a space between the IC chip 50 and the base film 41 to protectelectrical connections.

As discussed above, since the second output patterns 43 are located onthe top surface of the base film 41, it becomes possible to draw out thesecond output patterns 43 in the same direction as the first outputpatterns 42 and across the first longer side 50 a of chip 50. That is,although the second output pads 52 b as well as the input pads arearranged along the second longer side 50 b, the second output patterns43 directly extend toward and across the first longer side 50 a withoutpassing through the second peripheral region 48.

By arranging the second output pads 52 b along the second longer side 50b, the size of the IC chip 50 can be considerably reduced. For example,if this embodiment of the invention is applied to a conventional IC chipotherwise 16850 μm in width and 1000 μm in length, the width of the ICchip can be reduced to 9359 μm, thus achieving a decrease of 44.5%.Consider a conventional IC chip with two hundred sixty three of theoutput pads along the first longer side 50 a and the shorter side 50 c,and with twenty of the input pads along the second longer side 50 b. Incontrast, the described embodiment of the present invention shifts onehundred twenty of the output pads 52 b to the second longer side 50 b.

For electrical connections with the LCD panel, the second outputpatterns 43 formed on the top surface of the base film 41 can beconnected again to the bottom surface near the first peripheral region.This is illustrated in FIGS. 6 and 7.

FIG. 6 shows, in a partial plan view, outer circuit patterns of the TABpackage 40 shown in FIGS. 4 and 5. FIG. 7 is a cross-sectional viewtaken along the line VII-VII in FIG. 6.

Referring to FIGS. 6 and 7, the TAB package 40 is joined to the TFTsubstrate 11 of the LCD panel at the first peripheral region 47 of thebase film 41. As shown in FIG. 6, the first and second output patterns42 and 43 are drawn out in interleaved fashion and extend to the firstperipheral region 47. Particularly, and as shown in FIG. 7, the majorparts 43 a of the second output patterns 43, i.e., those on the topsurface of the base film 41, are connected to additional minor parts 43e, i.e., on the bottom surface of the base film 41, through secondconnection vias 43 d. Therefore, the terminal portion of the secondoutput patterns 43, i.e., at the first peripheral region 47, occupy thesame plane as the first output patterns 42 and are thereby collectivelyjoined to the TFT substrate 11.

Although not depicted in FIGS. 6 and 7, the third output patterns 44 andthe input patterns are also drawn out on the bottom surface of the basefilm 41 and extend to the first peripheral region 47.

The circuit patterns of the TAB package according to the presentinvention may be different in structure from those in theabove-discussed embodiment. FIG. 8 shows, in a plan view, a padarrangement of an IC chip 70 and circuit patterns of a TAB package 60 inaccordance with another exemplary embodiment of the present invention.

Referring to FIG. 8, the IC chip 70 has a first longer side 70 a, asecond longer side 70 b, and a pair of shorter sides 70 c. The IC chip70 further has a great number of I/O pads arranged thereon. In thisembodiment, the output pads 72 a and 72 b are arranged along two longersides 70 a and 70 b, respectively. Hereinafter, output pads 72 aarranged along the first longer side 70 a will be referred to as firstoutput pads, and output pads 72 b arranged along the second longer side70 b will be referred to as second output pads.

The first output pads 72 a are arranged along the whole of the firstlonger side 70 a, and the second output pads 72 b are arranged alongparts of the second longer side 70 b. The input pads (not shown) arearranged along parts of the second longer side 70 b. For example, thesecond output pads 72 a are located near both ends of the second longerside 70 b, and the input pads are located around the center of thesecond longer side 70 b. The number of the first output pads 72 a isgreater than the number of the second output pads 72 b. Metal bumps (notshown) are formed on the output pads 72 a and 72 b and the input pads,respectively.

The IC chip 70 is mechanically and electrically connected to circuitpatterns 62 and 63 on a bottom surface of a base film 61 through themetal bumps. The circuit patterns have first output patterns 62connected to the first output pads 72 a, second output patterns 63connected to the second output pads 72 b, and input patterns (not shown)connected to the input pads.

The first output patterns 62 drawn out from the first output pads 72 across over the first longer side 70 a of the IC chip 70. On the otherhand, the second output patterns 63 drawn out from the second outputpads 72 b cross over the adjacent shorter side 70 c. Although not shown,the input patterns drawn out from the input pads cross over the secondlonger side 70 b.

If the second output patterns 63 are drawn out through the shorter side70 c as illustrated, more output pads 72 a can be disposed along thesecond longer side 70 b than conventional output pads, e.g., pads 32 ain FIG. 3, when disposed to the shorter side. In other words, the pitch(P2) of the second output patterns 63 is smaller than the pitch (P1) ofthe second output pads 72 b and patterns 63 are made more dense thanthat of pads 72 b.

Alternatively, if the same number of the output pads are disposed alongthe second longer side 70 b instead of the shorter side 70 c, the lengthof the shorter side 70 c can be reduced.

FIG. 9 illustrates a further embodiment similar to that of FIGS. 4 and5, but without longitudinally offsetting pad locations. In FIG. 9,package 80 includes a film 81 bearing first circuit patterns 82 andsecond circuit patterns 83. Package 80 further includes an integratedcircuit chip 90 having a first longer side 90 a and a second longer side90 b. Output pads 92 a are arranged along, for example, the whole of thefirst longer side 90 a while output pads 92 b are arranged alongportions of the second longer side 90 b. The bottom surface of film 81,i.e., facing chip 90, carries patterns 82 which couple by way ofcorresponding bumps 91 a to pads 92 a. In other words, circuit patterns82 lie entirely on the bottom surface of film 81. Circuit patterns 83,however, are routed in a manner similar to patterns 43, i.e., with amajor portion 83 a across the top surface of film 81, a first minorportion 83 b coupled directly to a corresponding bump 91 b, and a via 83c coupling minor portion 83 b and major portion 83 a through film 81.

Pads 90 a and 90 b occupy similar longitudinal locations along side 90 aand side 90 b, respectively. Major portions 83 a of patterns 83 include,intermediate side 90 a and side 90 b, a routing offsets 85 to locateeach pattern 83 between a pair of patterns 82. In other words, routingoffsets 85 allow patterns 82 and 83 to extend from chip 90 in a commondirection, i.e., toward and over side 90 a while passing over side 90 ain interleaved fashion.

While not shown in FIG. 9, it will be understood that patterns 83 can becoupled back to the bottom surface of film 81 by way of a second viathrough film 81 and second minor portion on the bottom surface of film81 for connection in a peripheral region adjacent a TFT substrate. Inother words, in a manner similar to that of patterns 43.

The circuit patterns of the TAB package according to some embodiments ofthe present invention may have a mixed structure combining theabove-discussed embodiments. Moreover, the TAB package according to thepresent invention may be usefully applied to the LCD module.

While this invention has been particularly shown and described withreference to exemplary embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade therein without departing from the spirit and scope of theinvention as defined by the appended claims.

1. A package comprising: an integrated circuit chip including a firstlonger side, a second longer side, a pair of shorter sides, and aplurality of input/output pads arranged thereon, the input/output padshaving first output pads arranged along the first longer side, andsecond output pads arranged along the second longer side; and a basefilm including a top surface, a bottom surface opposing to the topsurface, first output patterns formed on the bottom surface, and secondoutput patterns formed on the bottom surface, the first output patternsbeing electrically connectable to the first output pads and directed topass over the first longer side, the second output patterns beingelectrically connectable to the second output pads and directed to passover at least one of the shorter sides.
 2. The package of claim 1,wherein the integrated circuit chip further includes conductive bumpsformed on the respective first and second output pads.
 3. The package ofclaim 2, wherein the first and second output patterns are joined to theconductive bumps on the respective output pads.
 4. The package of claim1, wherein the number of the second output pads is smaller than thenumber of the first output pads.
 5. The package of claim 1, wherein theplurality of input/output pads further include input pads arranged alongthe second longer side.
 6. The package of claim 5, wherein the base filmfurther includes input patterns arranged to electrically connect to theinput pads and to pass over the second longer side.
 7. The package ofclaim 1, wherein a pitch of the second output patterns is smaller than apitch of the second output pads.